1The semiconductor industry faces significant challenges in meeting the growing demand for high efficiency and product quality. Modern fabs must ramp up capacity, producing hundreds of thousands of wafers each month. Achieving high yield rates is also crucial—advanced processes require yields above 90%, while mature technologies demand at least 85%.
Cobots handle the loading and unloading tasks, working alongside packaging equipment to complete the semiconductor encapsulation process. The robot retrieves lead frames from the die sorter and places them into the molding press, then loads resin-filled trays into the press. After a about a 2-minute cycle, the robot removes the finished trays and places them on a rack. A quick-change flange allows the robot to efficiently handle different frames, enhancing loading and unloading efficiency.
In wafer processing, manual handling can be prone to errors and contamination. Cobots are ideal for loading and unloading wafers in various machines,ensuring precise handling throughout the process. They can automatically transfer wafers from the storage area to the processing equipment, minimizing the risk of damage or contamination. The robots can also operate within cleanroom environments, maintaining the required cleanliness standards essential for semiconductor manufacturing. Cobots automation not only increases efficiency and reduces manual labor but also enhances accuracy and consistency in material handling, contributing to overall productivity in the manufacturing process.